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    IC Test and Burn-in Sockets
  
 

TSOP 

    Thin Small Outline Package. A surface-mount package with fine-pitch leads on two sides. This package is very low profile and commonly available in a reverse (mirror image) pinout used to simplify circuit board layout. Usually 32 to 44 pins.
      Pitch = 0.4mm
      Pitch = 0.50mm
      Pitch = 0.55mm
      Pitch = 0.635mm
      Pitch = 0.65mm
      Pitch = 0.80mm Specifications for Enplas
      Pitch = 1.27mm Specifications for Yamaichi 
   
 
　
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