中  文   English
Anytime Anywhe
re always by your side !
top_2
 
    IC Test and Burn-in Sockets
  
 

SSOP 

    SSOP SHRINK SMALL OUTLINE PACKAGE - The SSOP package body size is compressed and the lead pitch is tightened to obtain a small version of the standard SOIC package.

      Pitch = 0.40mm
      Pitch = 0.50mm
      Pitch = 0.60mm
      Pitch = 0.635mm
      Pitch = 0.65mm
      Pitch = 1.00mm
      Pitch = 1.27mm Specifications for Enplas
   Specifications for Yamaichi 
   

 SSOP Socket; IC Socket;SSOP Package Socket;SSOP IC Socket;
　
　 Prosystems Electronic Technology Ltd. TEL:86-755-27889099   FAX:86-755-27889018
　
©Copyright 2004-2006 PROSYSTEMS. All Rights Reserved