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    IC Test and Burn-in Sockets
 
 

IC Test and Burn-in Sockets 

 

BGA
( Ball Grid Array )
DIP
( Dual In-Line Package )
MLF
( Micro Lead Frame )
PLCC
( Plastic Leaded Chip Carrier )
QFN
( Quad Flatpack Package )
QFP
( Quad Flatpack Package )
SOIC
( Small Out-Line Integrated Circuit )
SOP
( Small Out-Line Package )
TSOP
( Think Small Out-Line Package )
SSOP
( Shrink Small Out-Line Package )

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