SMT Devices QFN (Quad Flat Non-leaded) Packages TH Sockets - Open Top and Clamshell Types

   
  Specifications
Insulation Resistance: 10,000MΩ min. at 100V DC     
 Withstanding Voltage: 500V AC for 1 minute                  
Contact Resistance: 30mΩ max. at 10mA/20mV max.
Operating Temp.Range: –40°C to +150°C                    
Contact Force: 11gf per pin approx.                                
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Polyethersulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
   


Open Top Types NP445 and NP364 Part Number for Socket (Details)
Specifications / Material and Finish
(see above)
 
 
Features
 NP445 - Centre Contact available for exposed pads
 NP364 - Buckling Beam contacts
   
Clamshell Type
Part Number for Socket (Details)
 

 

Specifications / Material and Finish
(see above)


Features                                                          
 Centre Contact available for exposed pads
 Probe Pins                                                        
 Heat sink                                                           
Contact Types  
   

产品型号
间距
引脚数量
IC Body Size
A x B
Centre Pins
Cover
Socket Dimensions
C x D
QFN11T024-002
0.5
24
3.5 x 4.5
no
LID
32 x 29
QFN11T032-003
0.5
32
5 x 5
yes
LID
32 x 29
QFN11T032-004
0.5
32
4.5 x 5.5
no
LID
32 x 29
NP445-032-003
0.5
32
5 x 5
yes
open top
32.8 x 32.8
QFN11T040-004
0.5
36/40
6 x 6
yes
LID
32 x 29
QFN11T040-005
0.5
40
4.5 x 5.5
no
LID
35 x 32
QFN11T040-006
0.5
40
6 x 6
yes
LID
32 x 29
QFN11T048-005
0.5
44/48
7 x 7
yes
LID
32 x 29
QFN11T048-008
0.5
48
7 x 7
no
LID
35 x 32
QFN11T048-008.A101121-001
0.5
48
7 x 7
yes
LID
35 x 32
NP445-048-001
0.5
48
7 x 7
yes
open top
32.8 x 32.8
QFN11T056-001
0.5
52/56
8 x 8
yes
LID
32 x 29
NP445-064-002
0.5
64
9 x 9
yes
open top
32.8 x 32.8
NP364-01649
1.0
16
6 x 6
no
open top
25 x 25